LoW-Temperature Solder Pastes
Bi+ Solder Alloy
The patented Bi+ alloy, also known as Indalloy®303, is an innovative low-temperature solder developed by Indium Corporation to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. With enhanced thermal cycling capabilities and compatibility with Indium Corporation’s low-temperature flux technologies, Bi+ sets a new standard in the soldering industry.
技术支持：铟泰公司
- Temperature-Sensitive Components
- Enhanced Thermal Cycling Reliability
- 降低拥有成本
产品概览
减少热翘曲
Minimizes warpage in multilayer boards and miniaturized components, reducing defect rates during assembly.
降低成本
为客户提供负担得起的材料和机会，以减少能源费用和烤箱维护投资。
Enhanced Thermal Cycling Reliability
Provides superior performance in thermal cycling, ensuring longevity and reliability of solder joints.
Enables Step Soldering
Allows for step soldering and other complex designs that require a solder alloy with lower reflow temperature.
概况
相关应用
The Bi+ alloy is suitable for a number of applications. Contact Indium Corporation Technical Support for more information.
相关市场
Bi+ delivers excellent low-temperature performance compared to traditional Bismuth containing alloys and can be used in various markets.
相关产品
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