Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at the LED Assembly, Reliability & Testing Symposium in Atlanta, Georgia on Dec. 1.
As the electronics industry rapidly advances toward miniaturization, two drivers dictate manufacturer success: low-cost and high-reliability. This course examines the roles of solder composition on cost and reliability, including a review of material properties, soldering performance, known failure modes, and the primary merits of alloys.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili, della gestione termica e del solare. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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