Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Chen will present on the topic of Fluxes Suppressing Non-Wet Opens at BGA Assembly. The paper examines the advancement of miniaturization and its impact on the increased severity of thermal warpage and resultant non-wet opens (NWO) at BGA assembly. Chen’s paper studies a “cold-welding barrier” method developed to suppress NWO.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She has been with the company since 2008, and has worked on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications. She is also responsible for new technology and new product development. Chen received her bachelor’s degree in chemical engineering in 2005 and her master’s degree in polymer chemistry and physics in 2008 from Suzhou University.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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