Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Chen will present on the topic of Fluxes Suppressing Non-Wet Opens at BGA Assembly. The paper examines the advancement of miniaturization and its impact on the increased severity of thermal warpage and resultant non-wet opens (NWO) at BGA assembly. Chen’s paper studies a “cold-welding barrier” method developed to suppress NWO.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She has been with the company since 2008, and has worked on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications. She is also responsible for new technology and new product development. Chen received her bachelor’s degree in chemical engineering in 2005 and her master’s degree in polymer chemistry and physics in 2008 from Suzhou University.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
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