Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Chen will present on the topic of Fluxes Suppressing Non-Wet Opens at BGA Assembly. The paper examines the advancement of miniaturization and its impact on the increased severity of thermal warpage and resultant non-wet opens (NWO) at BGA assembly. Chen’s paper studies a “cold-welding barrier” method developed to suppress NWO.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She has been with the company since 2008, and has worked on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications. She is also responsible for new technology and new product development. Chen received her bachelor’s degree in chemical engineering in 2005 and her master’s degree in polymer chemistry and physics in 2008 from Suzhou University.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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