Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy.
Dr. Lee's presentation entitled Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applicationsreviews test results that demonstrate how a new alloy excels in harsh environments, including a wide temperature range and high CTE mismatch. Dr. Lee will also share data from existing application qualifications.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
To view additional papers authored by Dr. Lee and other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
