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Indium Corporation Expert to Present at World Congress of Smart Materials 2019

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy. 

Dr. Lee's presentation entitled Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applicationsreviews test results that demonstrate how a new alloy excels in harsh environments, including a wide temperature range and high CTE mismatch. Dr. Lee will also share data from existing application qualifications.

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.

To view additional papers authored by Dr. Lee and other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂;硬钎焊 ;热界面材料;溅射靶材 ;铟、镓(Ga) 、锗和锡等金属及无机材料化合物 ;以及NanoFoil®。该公司成立于1934年,拥有全球技术支持网络,并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。