Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif.
Vice President of Technology Dr. Ning-Cheng Lee will lead two presentations during sessions on Alloy Reliability I (S15) and Alloy Reliability II (S23):
- Sn3.2/Ag0.7/Cu5.5/Sb Solder Alloy With High-Reliability Performance Up to 175°C
- Low-Temperature Solder Alloys With High-Reliability Performance
Additionally, Eric Bastow, Assistant Technical Manager, America’s Region, and Robert McKerrow, Product Specialist – Engineered Solders will present on:
- The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin-Based No-Clean Solder Paste Flux Residue, during a session on Surface Insulation Resistance (S10); and
- Solder Fortification® and Flux-Coated Preforms during the poster presentation sessions on Wednesday, Feb. 28.
For more information on the technical and poster sessions offered at IPC APEX, visit www.ipcapexexpo.org.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
