Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif.
Vice President of Technology Dr. Ning-Cheng Lee will lead two presentations during sessions on Alloy Reliability I (S15) and Alloy Reliability II (S23):
- Sn3.2/Ag0.7/Cu5.5/Sb Solder Alloy With High-Reliability Performance Up to 175°C
- Low-Temperature Solder Alloys With High-Reliability Performance
Additionally, Eric Bastow, Assistant Technical Manager, America’s Region, and Robert McKerrow, Product Specialist – Engineered Solders will present on:
- The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin-Based No-Clean Solder Paste Flux Residue, during a session on Surface Insulation Resistance (S10); and
- Solder Fortification® and Flux-Coated Preforms during the poster presentation sessions on Wednesday, Feb. 28.
For more information on the technical and poster sessions offered at IPC APEX, visit www.ipcapexexpo.org.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
