Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif.
Vice President of Technology Dr. Ning-Cheng Lee will lead two presentations during sessions on Alloy Reliability I (S15) and Alloy Reliability II (S23):
- Sn3.2/Ag0.7/Cu5.5/Sb Solder Alloy With High-Reliability Performance Up to 175°C
- Low-Temperature Solder Alloys With High-Reliability Performance
Additionally, Eric Bastow, Assistant Technical Manager, America’s Region, and Robert McKerrow, Product Specialist – Engineered Solders will present on:
- The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin-Based No-Clean Solder Paste Flux Residue, during a session on Surface Insulation Resistance (S10); and
- Solder Fortification® and Flux-Coated Preforms during the poster presentation sessions on Wednesday, Feb. 28.
For more information on the technical and poster sessions offered at IPC APEX, visit www.ipcapexexpo.org.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
