Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
First, on October 3, Senior Research Chemist Dr. Guangyu Fan will deliver a presentation titled Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for Computing Electronics Cooling. Indium Corporation has developed gallium-based liquid metal pastes with low-content solid metal particle additives (LMPMPs) to improve thermal performance and control bondline thickness in thermal interface materials (TIMs). These materials, which are synthesized by introducing gallium oxide into liquid metal alloys, were extensively studied for their thermal properties and reliability through power cycling tests. The research highlights the significant impact of power density, bondline thickness, and various liquid metal alloys on the thermal properties of LMPMPs, which were found to outperform polymer-based thermal grease in terms of thermal performance.
Later in the afternoon, Product Development Specialist for Thermal Interface Materials Milo Lazi‘s presentation, A Jettable and Dispensable Liquid Metal Paste as Thermal Interface, will examine the thermal conductivity, viscosity, and jetting and dispensing performance of newly developed liquid metal paste thermal interface materials (LMP TIMs) compared to traditional metals TIMs. Generally, metal TIMs have high thermal conductivity and can be applied in a thin layer. Recently, liquid metal TIMs are getting more attention, especially in gaming and high-performance applications. They are excellent in terms of accommodating imperfections of the materials they are connecting but can be risky because of their physical properties. To overcome this challenge, LMP TIMs were developed.
Lastly, on October 5, Product Specialist for Semiconductor and Advanced Assembly Materials Evan Griffith will give a presentation titled Optimizing Type 7 Solder Paste Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications. Solder paste printing is the preferred method for System-in-Package (SiP) assembly, but as components shrink and stencil openings become smaller, consistent printing performance remains a challenge. Additionally, in fine-pitch applications with reduced component standoff height, cleanability becomes a concern, especially when using water-soluble pastes as pure DI water becomes less effective. Griffith will investigate important parameters, from a materials supplier’s perspective, for meeting the challenges of fine-feature solder paste printing and package assembly. The presentation will examine innovations in solder powder technology which allow for consistent solder paste (Type 7) printing at 60um apertures, and the effects of laser-cut and electroform stencil manufacturing designs on solder paste print consistency. Finally, Griffith will explore solder paste cleanability.
Dr. Fan joined Indium Corporation in 2011. He has a doctorate degree in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is also a graduate of the Dale Carnegie Leadership Skills for Success program.
Lazi è responsabile dello sviluppo di nuovi materiali e prodotti termici e della fornitura di soluzioni per le sfide e le applicazioni dei clienti. Sviluppa inoltre nuovi metodi di test per valutare i prodotti termici e di potenza e raccoglie dati sui prodotti nuovi ed esistenti per le presentazioni di marketing. Ha conseguito un master in ingegneria elettronica e una laurea in ingegneria elettrica presso l'Università di Nis in Serbia. È un ingegnere dell'efficienza energetica certificato dalla Camera degli ingegneri serba di Belgrado, un ingegnere di processo SMT certificato e parla correntemente inglese, serbo, croato e bosniaco.
Griffith is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a Jingya Huang. È inoltre possibile seguire i nostri esperti, From One Engineer To Another (#FOETA), all'indirizzo www.linkedin.com/company/indium-corporation/.
