Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
First, on October 3, Senior Research Chemist Dr. Guangyu Fan will deliver a presentation titled Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for Computing Electronics Cooling. Indium Corporation has developed gallium-based liquid metal pastes with low-content solid metal particle additives (LMPMPs) to improve thermal performance and control bondline thickness in thermal interface materials (TIMs). These materials, which are synthesized by introducing gallium oxide into liquid metal alloys, were extensively studied for their thermal properties and reliability through power cycling tests. The research highlights the significant impact of power density, bondline thickness, and various liquid metal alloys on the thermal properties of LMPMPs, which were found to outperform polymer-based thermal grease in terms of thermal performance.
Later in the afternoon, Product Development Specialist for Thermal Interface Materials Milo Lazi‘s presentation, A Jettable and Dispensable Liquid Metal Paste as Thermal Interface, will examine the thermal conductivity, viscosity, and jetting and dispensing performance of newly developed liquid metal paste thermal interface materials (LMP TIMs) compared to traditional metals TIMs. Generally, metal TIMs have high thermal conductivity and can be applied in a thin layer. Recently, liquid metal TIMs are getting more attention, especially in gaming and high-performance applications. They are excellent in terms of accommodating imperfections of the materials they are connecting but can be risky because of their physical properties. To overcome this challenge, LMP TIMs were developed.
Lastly, on October 5, Product Specialist for Semiconductor and Advanced Assembly Materials Evan Griffith will give a presentation titled Optimizing Type 7 Solder Paste Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications. Solder paste printing is the preferred method for System-in-Package (SiP) assembly, but as components shrink and stencil openings become smaller, consistent printing performance remains a challenge. Additionally, in fine-pitch applications with reduced component standoff height, cleanability becomes a concern, especially when using water-soluble pastes as pure DI water becomes less effective. Griffith will investigate important parameters, from a materials supplier’s perspective, for meeting the challenges of fine-feature solder paste printing and package assembly. The presentation will examine innovations in solder powder technology which allow for consistent solder paste (Type 7) printing at 60um apertures, and the effects of laser-cut and electroform stencil manufacturing designs on solder paste print consistency. Finally, Griffith will explore solder paste cleanability.
Dr. Fan joined Indium Corporation in 2011. He has a doctorate degree in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is also a graduate of the Dale Carnegie Leadership Skills for Success program.
Lazi 負責開發新的熱能材料和產品，並針對客戶的挑戰和應用提供解決方案。他還負責開發新的測試方法來評估電源和熱能產品，並收集新產品和現有產品的資料用於行銷簡報。他擁有塞爾維亞 Nis 大學的電子工程碩士學位和電機工程學士學位。他是貝爾格萊德塞爾維亞工程師商會認證的能源效率工程師；認證的 SMT 製程工程師；能說流利的英語、塞爾維亞語、克羅地亞語和波斯尼亞語。
Griffith is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation 的相關資訊，請造訪indiumstg.wpenginepowered.com或寄送電子郵件至Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 上追蹤我們的專家專欄「From One Engineer To Another」 （#FOETA）。
