Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
First, on October 3, Senior Research Chemist Dr. Guangyu Fan will deliver a presentation titled Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for Computing Electronics Cooling. Indium Corporation has developed gallium-based liquid metal pastes with low-content solid metal particle additives (LMPMPs) to improve thermal performance and control bondline thickness in thermal interface materials (TIMs). These materials, which are synthesized by introducing gallium oxide into liquid metal alloys, were extensively studied for their thermal properties and reliability through power cycling tests. The research highlights the significant impact of power density, bondline thickness, and various liquid metal alloys on the thermal properties of LMPMPs, which were found to outperform polymer-based thermal grease in terms of thermal performance.
Later in the afternoon, Product Development Specialist for Thermal Interface Materials Milo Lazi‘s presentation, A Jettable and Dispensable Liquid Metal Paste as Thermal Interface, will examine the thermal conductivity, viscosity, and jetting and dispensing performance of newly developed liquid metal paste thermal interface materials (LMP TIMs) compared to traditional metals TIMs. Generally, metal TIMs have high thermal conductivity and can be applied in a thin layer. Recently, liquid metal TIMs are getting more attention, especially in gaming and high-performance applications. They are excellent in terms of accommodating imperfections of the materials they are connecting but can be risky because of their physical properties. To overcome this challenge, LMP TIMs were developed.
Lastly, on October 5, Product Specialist for Semiconductor and Advanced Assembly Materials Evan Griffith will give a presentation titled Optimizing Type 7 Solder Paste Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications. Solder paste printing is the preferred method for System-in-Package (SiP) assembly, but as components shrink and stencil openings become smaller, consistent printing performance remains a challenge. Additionally, in fine-pitch applications with reduced component standoff height, cleanability becomes a concern, especially when using water-soluble pastes as pure DI water becomes less effective. Griffith will investigate important parameters, from a materials supplier’s perspective, for meeting the challenges of fine-feature solder paste printing and package assembly. The presentation will examine innovations in solder powder technology which allow for consistent solder paste (Type 7) printing at 60um apertures, and the effects of laser-cut and electroform stencil manufacturing designs on solder paste print consistency. Finally, Griffith will explore solder paste cleanability.
Dr. Fan joined Indium Corporation in 2011. He has a doctorate degree in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is also a graduate of the Dale Carnegie Leadership Skills for Success program.
Lazi 负责开发新的热材料和产品，并为客户面临的挑战和应用提供解决方案。他还开发新的测试方法来评估功率和热产品，并收集新产品和现有产品的数据用于市场推广。他拥有塞尔维亚尼什大学电子工程硕士学位和电气工程学士学位。他是贝尔格莱德塞尔维亚工程师协会认证的能效工程师、SMT 工艺认证工程师，能说流利的英语、塞尔维亚语、克罗地亚语和波斯尼亚语。
Griffith is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
