Indium Corporation's Aaron Yan, area technical manager – eastern China, will share his expertise at an IPC Seminar on Oct. 29 in Suzhou, China.
Yan's presentation, The Challenge of Solder Paste Application in the Mobile Communication Industry, will discuss the solder paste requirements to address the component miniaturization trend, halogen-free flux activity level demands, and the continuing demand for reliable low-cost, Pb-free alloys.
Yan is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected].
