Indium Corporation's Aaron Yan, area technical manager – eastern China, will share his expertise at an IPC Seminar on Oct. 29 in Suzhou, China.
Yan's presentation, The Challenge of Solder Paste Application in the Mobile Communication Industry, will discuss the solder paste requirements to address the component miniaturization trend, halogen-free flux activity level demands, and the continuing demand for reliable low-cost, Pb-free alloys.
Yan is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
