Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRA™-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation's precision, high-volume production lines can produce AuLTRA™-fine ribbons as small as 0.254mm (0.010") wide by 0.0152mm (0.0006") thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producing spools >15 meters of continuous length.
For more information about Indium Corporation's precision gold products, see our experts at the show at booth #ISP2-0407 or visit indiumstg.wpenginepowered.com/gold.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
