Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRA™-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation's precision, high-volume production lines can produce AuLTRA™-fine ribbons as small as 0.254mm (0.010") wide by 0.0152mm (0.0006") thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producing spools >15 meters of continuous length.
For more information about Indium Corporation's precision gold products, see our experts at the show at booth #ISP2-0407 or visit indiumstg.wpenginepowered.com/gold.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
