Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRA™-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation's precision, high-volume production lines can produce AuLTRA™-fine ribbons as small as 0.254mm (0.010") wide by 0.0152mm (0.0006") thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producing spools >15 meters of continuous length.
For more information about Indium Corporation's precision gold products, see our experts at the show at booth #ISP2-0407 or visit indiumstg.wpenginepowered.com/gold.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
