Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRA™-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation's precision, high-volume production lines can produce AuLTRA™-fine ribbons as small as 0.254mm (0.010") wide by 0.0152mm (0.0006") thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producing spools >15 meters of continuous length.
For more information about Indium Corporation's precision gold products, see our experts at the show at booth #ISP2-0407 or visit indiumstg.wpenginepowered.com/gold.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
