Pressureless Sintering
InBAKE™
Indium Corporation’s InBAKE™series of pressure-less sinter pastes is specifically designed for traditional batch oven sintering. Available in copper (Cu), these pure sinter pastes contain no fillers, epoxy, or polymers in the bonding layer, ensuring a clean and efficient sintering process.
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- Optimal Dispensability
- Pressureless Sintering
- Pure Sintered Interconnect
Product Overview
Excellent in High Operating Temperatures
Cu has a melting point of 1084.6°C, making it an excellent candidate for bonding materials in high-temperature applications.
Exceptional Thermal and Electrical Conductivity
InBAKE™ pressure-less sinter pastes serve as outstanding die-attach materials, particularly in applications where efficient heat dissipation is crucial for optimal performance.
Quick Facts
Pressureless sintering is ideal for power semiconductor die-attach applications in power LEDs and RF/power amplifier packaging and assembly.
InBAKE™ Products
| Product | Material | Description |
|---|---|---|
| InBAKE™45 Series | Silver | Contact Indium Corporation for product recommendation |
| InBAKE™29 Series | Copper | Contact Indium Corporation for product recommendation |
Product Data Sheets
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 (A4) R0.pdf
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 R0.pdf
InBAKE 29 (76-29-6) Cu Sinter Paste PDS 99947 (A4) R1.pdf
InBAKE 29 (76-29-6) Cu Sinter Paste PDS 99947 R1.pdf
Related Applications
InBAKE™is suitable for the below applications:
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Die-Attach
Die-attach solutions include solder pastes to gold-based
Related Markets
Indium Corporation’s InBAKE™is available for use in a wide-range of markets.
Related Products
Indium Corporation provides a variety of sintering materials tailored to meet specific application requirements. Contact our team for expert guidance in selecting the ideal product and optimizing your process.
InFORCE®
InFORCE Series sinter pastes excel in high-performance
QuickSINTER®
Minimize sintering time on small dies to under 20
Pressure Sintering
High metal-load pressure Ag or Cu sintering materials
Pressureless Sintering
Pressure-less silver and copper sinter
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
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