NanoFoil®
NanoFoil® is a versatile reactive multi-layer foil that delivers instantaneous heat for a wide range of applications across numerous industries, including semiconductor, aerospace, automotive, electronics, biomedical, and defense. As a reliable heat source, NanoFoil® offers predictable and controllable heating, enabling localized soldering without subjecting surrounding components to unwanted heat exposure.
Powered by Indium Corporation
- Instant, Precise Soldering at Room Temperature
- Universal Solder Compatibility
- Facilitates Fluxless Soldering
Product Overview
Solderable Surfaces Required
Standard- and Tin-Plated NanoFoil®
NanoFoil® is a localized heat source that enables material joining below 450°C and is available in two options: standard, which is used with solder preforms or coated surfaces, and tin-plated, which features 10 μm of pure tin on both sides for direct bonding to solderable surfaces.
Reactive Multi-Layered Foil
Vapor-deposited layers of aluminum and nickel deliver up to 1,500°C of localized heat in milliseconds, activated by a small energy pulse—ideal for rapid, precise bonding and reaction initiation.
NanoFoil® Activation
NanoFoil® can be activated with a small pulse of local energy applied using optical, electrical, or thermal sources. Applying energy at a specific point is just as important as the total amount of energy applied.
Features
NanoBond® is the process of bonding two components with solder using NanoFoil® as a heat source. When activated, the foil creates a self-sustaining reaction that acts as a rapid and controllable localized heat source to melt adjoining solder layers, bonding components together.
1,350°–1,500°C (2,460°–2,730°F)
Maximum Reaction Temperature
6.5–8 meters/second
Reaction Velocity
1,050–1,250J/g
Heat of Reaction
35–50W/mK
Thermal Conductivity
NanoFoil® Specification Recommendations
NanoFoil® is offered in standard sheet form, 43″ x 9″, or can be customized to meet your specifications with sizes as small as 1 mm x 1 mm. It is available in two thicknesses: 40 μm and 60 μm. Plus, NanoFoil® can be enhanced with a tin plating option, featuring a 10 μm layer of pure tin on both sides. This tin-plated NanoFoil® only requires solderable surfaces for effective bonding.
| Recommended NanoFoil® | Component #1 Plating | Component #2 Plating |
|---|---|---|
| Tin-plated | ENIG, Au, Ag | ENIG, Au, Ag |
| Tin-plated | ENIG, Au, Ag | Solder-plated |
| Standard using solder preforms* | ENIG, Au, Ag | ENIG, Au, Ag |
| Standard | Solder-plated | Solder-plated |
*Solder preforms can be used with NanoFoil® and appropriate surfaces.
Product Data Sheets
NanoFoil® PDS 98569 (A4) R4.pdf
NanoFoil® PDS 98569 R4.pdf
Related Applications
NanoFoil® is suitable for a variety of industry-related applications.
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Related Markets
Indium Corporation’s NanoFoil® is available for use in a wide range of markets.
Related Products
Solder Preforms
Solder preforms: versatile materials solving sealing & thermal
Thermal Interface Materials
Metal-based TIMs offer low thermal resistance & customizable
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