solder alloys
Durafuse® HT
As the standout in the Durafuse® mixed alloy family, Durafuse® HT is a Pb-free solder paste engineered as a direct replacement for traditional high-Pb die-attach solders. Designed for applications that demand re-melting temperatures higher than standard PCBA reflow levels (up to 260°C), this is the only Pb-free solution available on the market that meets this specific requirement.
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- Pb-Free High-Temperature Solution
- Drop-In Replacement
- Electrical and Thermal Properties ≥ High-Pb
Product Overview
High Shear Strength
Durafuse® HT maintains shear strength >15MPa, even at temperatures around 280°C, outperforming high-Pb solder.
Replacement to High-Pb Solder
Durafuse® HT does not require a special set up when used in traditional processes that cater to Pb-containing solder paste. This reduces the risk of adopting the new materials and the time to market.
Superior to Pb Alloys
Though Pb-free, Durafuse® HT outperforms high Pb-containing materials in thermal conductivity, thermal mechanical strength, and electrical conductivity.
Sustainable
By replacing Pb in applications, Durafuse® HT helps customers achieve sustainability goals and comply with environmental regulations and policies.
Product Data Sheets
Durafuse® HT High-Temperature Pb-Free Solder Paste PDS 100025 (A4) R0.pdf
Durafuse® HT High-Temperature Pb-Free Solder Paste PDS 100025 R0.pdf
Related Applications
Durafuse® HT solder paste is applicable for a variety of industry applications.
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Clip-Attach / Lead-Frame
Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and
Die-Attach
Die-attach solutions include solder pastes to gold-based
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Related Markets
Durafuse® HT is intended for die-attach and clip-attach applications for discrete power devices and SMD multi-chip module power devices, which are widely used in certain markets.
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