Solder Alloys
Durafuse® LT
Durafuse® LT is a patented low- to mid-temperature mixed solder alloy system developed by Indium Corporation, specifically designed for high-reliability applications that require a lower reflow temperature. Leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) have embraced this versatile solder paste technology for various high-reliability applications, attracted by its numerous advantages and strengths.
Powered by Indium Corporation
- Low- to Mid-Temperature
- Reflows From 205°C or Higher
- High-Reliability
Product Overview
Drop Shock Reliability
Durafuse® LT offers improved drop shock resilience, outperforming bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys and demonstrating superior performance over SAC305 when optimum process setups are in place.
Thermal Cycling Reliability
Durafuse® LT provides unmatched ductility and exceptional TCT performance when reflowed at 220-245°C. Unlike conventional high-reliability solder pastes, which are rigid and susceptible to cracking, this solder paste offers distinct advantages in wafer-level CSP assembly. It effectively reduces quad-flat no-leads (QFN) cracks, thus enhancing durability and performance in challenging applications.
Sustainability
Our research has shown that by implementing Durafuse® LT, customers can achieve energy savings of up to 15%* and reduce their carbon footprint to meet global sustainability requirements.
Applications with Large Temperature Gradients
When dealing with assembly applications that experience significant temperature differentials (large ΔT) and require varying reflow temperatures while maintaining solder joint reliability, Durafuse® LT provides a broad process range of 205°C or higher. This wide window simplifies the handling of complex designs.
Durafuse® LT Products
Adopted by leading OEMs and EMSs, the award-winning Durafuse® LT has been successful since its launch. This solder paste utilizes a range of both proven and novel flux formulas that demonstrate excellent performance. Additionally, we offer two other products in the Durafuse® line to cater to various requirements, including high-temperature Pb-free options and high-reliability solutions with low voiding.
Product Data Sheets
Durafuse® LT with Indium10.8HFT PDS 100118 (A4) R2.pdf
Durafuse® LT with Indium10.8HFT PDS 100118 R2.pdf
Durafuse® LT with Indium3.2HF PDS 100303 (A4) R0.pdf
Durafuse® LT with Indium10.2HFA Low-Temp Drop Shock Solution PDS 100122 R0.pdf
Related Applications
Durafuse® LT’s low-temperature capabilities are available for use in a variety of applications.
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Low-Temperature Soldering
Transform your operations with our low-temp soldering
Related Markets
Durafuse® LT is used in markets that require high reliability, particularly those involving thermally sensitive components or boards. It’s ideal for step soldering and is often utilized in a variety of applications and industries.
Related Products
Durafuse® Technology
A patented solder alloy technology to enable complex
Durafuse® HR
High-reliability & low-voiding Solder Alloy Durafuse®
Durafuse® HT
High-temperature Pb-free solder paste alloy Durafuse®
Low-Temperature Solder Pastes
Extensive range of low-temperature solder
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