Package-on-Package Flux

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

So what is the latest buzz on virtual reality? After a decade of development, this generation ofVR is packing a lot more technology into an even smaller space – but as material science

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Folks, This post is an excerpt fromIndium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction Printed circuit board (PCB) issues can be a challenge, but not all of

Phil Zarrow: Brook, we talk about choosing a flux. We start off with these classifications. What is the meaning of it? BrookSandy-Smith: They can mean a lot of different things to a lot of different

Folks, As Patty was walking past the Professor’s office on her way to see Pete and Rob, she decided to drop in. “Professor, I got the strangest phone call … a man claimed he had

Another advantage of Indium Corporation's epoxy flux, such as the 756-72, compared to underfill and other competitive epoxy flux options is that our epoxy flux is reworkable.The rework procedure

Often times, people assume that the dipping process is easy. It is…once you have taken the time up-front to optimize the process.This optimization can take a bit of time and trial and error.