PCB 助焊剂
包对包流量
In package-on-package (PoP) assembly, solder paste is applied to the substrate, and then the logic chip is placed on top. The memory package is dipped into PoP flux or paste, placed on the logic chip, and reflowed, typically using a no-clean process. PoP flux is preferred for easier setup and maintenance, while PoP solder paste, though more challenging due to bridging risks, is better for handling component warpage.
技术支持：铟泰公司
- Optimal Viscosity and Rheology
- 高收益率
- Improved Wettability and Solderability
产品概览
No-Clean
Our preferred formulas are developed for no-clean processes with Pb-free solders to help our customers maximize yield.
无气包装
无气包装确保了装配过程的一致性和可靠性。
Versatile Application Methods
Apply our PoP fluxes by dipping or dispensing methods to meet your application needs.
Excellent Solderability
Our products wet and solder well on various finishes such as Cu-OSP, AuNi, immersion Ag, and more.
产品数据表
PoP Paste Indium 9.88-HF PDS 98501 R9.pdf
8.9HF-LV 包上通量 PDS 98508 R9.pdf
89HFLV-B 片上封装助焊剂 PDS 99360 R4.pdf
89-LV 片上封装助焊剂 PDS 98511 R3.pdf
相关应用
Package-on-Package flux is suitable for the following applications:
相关市场
PoP technology is common across many key markets due to its ability to enhance device performance while saving space.
相关产品
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无铅焊膏
Utilize a range of Pb-free solder pastes…
专家支持，结果可靠
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