PCB Assembly Fluxes
Package-on-Package Flux
In package-on-package (PoP) assembly, solder paste is applied to the substrate, and then the logic chip is placed on top. The memory package is dipped into PoP flux or paste, placed on the logic chip, and reflowed, typically using a no-clean process. PoP flux is preferred for easier setup and maintenance, while PoP solder paste, though more challenging due to bridging risks, is better for handling component warpage.
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- Optimal Viscosity and Rheology
- High Yields
- Improved Wettability and Solderability
Product Overview
No-Clean
Our preferred formulas are developed for no-clean processes with Pb-free solders to help our customers maximize yield.
Airless Packaging
Airless packaging ensures a consistent and reliable assembly process.
Versatile Application Methods
Apply our PoP fluxes by dipping or dispensing methods to meet your application needs.
Excellent Solderability
Our products wet and solder well on various finishes such as Cu-OSP, AuNi, immersion Ag, and more.
Product Data Sheets
PoP Paste Indium 9.88-HF PDS 98501 R9.pdf
8.9HF-LV Package-on-Package Flux PDS 98508 R9.pdf
89HFLV-B Package-on-Package Flux PDS 99360 R4.pdf
89-LV Package-on-Package Flux PDS 98511 R3.pdf
Related Applications
Package-on-Package flux is suitable for the following applications:
PCB Assembly
Proven and cutting-edge materials for PCB assembly…