Heat-Spring®

Indium Corporation’s patented Heat-Spring® is a soft metal alloy thermal interface material (SMA-TIM) designed as a flexible, patterned foil that serves as an effective thermal conduit between two surfaces. This innovative product is intended for use in a range of high-performance applications, including TIM2, TIM3, TIM1.5, burn-in processes, and immersion cooling systems.

Powered by Indium Corporation

  • Ultra-Low Thermal Resistance
  • No Reflow or High-Temperature Cure
  • Proven Reliability
Close-up of a film strip showing the logo and text "INDUV" and "SIA" printed on it, set against a blue background.
ProductRecommended ApplicationsThickness RangeSpecial Features
HSD Heat-Spring®Small, well-designed interfaces with flat, smooth, and parallel surfaces (2-3 mil non-planar).Min: 0.004″ (100µm)
Max: 0.016″ (400µm)
Optimized for flat, smooth interfaces.
HSHP Heat-Spring®Applications with extruded, unfinished heat-sinks or field-fit plates with surface scarring or machine marks.
Can also be used in HSD applications.
Recommended for immersion cooling (2-5 mil non-planar).
Min: 0.006″ (150µm)
Max: 0.016″ (400µm)
High-profile variant of HSD with 2X compressibility.
HSK Heat-Spring®Burn-in applications requiring multiple insertions.
Features pure indium with an aluminum-clad barrier layer for durability.
Min: 0.006″ (150µm)
Max: 0.016″ (400µm)
Aluminum barrier prevents adhesion, staining, and cracking.
HSx Heat-Spring®Applications with large CTE mismatches, curved dies, or warping issues.
Recommended for immersion cooling (5-10 mil non-planar).
Min:0 .012″ (300µm)
Max: 0.040″ (1000µm)
High-profile variant of HSHP with 2X compressibility. Works well with lower pressures.

Clean and Reworkable TIM

Reclaimable and Recyclable

High Volume Production

Custom Alloys Available

Passes Thermal Cycling, Power Cycling, and HAST Testing

Graph showing thermal resistance over 1200 cycles for thermal grease, polymeric phase-change TIM, and compressible indium TIM.

Product Data Sheets

InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 (A4) R0.pdf
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 R0.pdf
Heat-Spring®–Ultra-Low Thermal Resistance No-Reflow as TIM1.5,2,3 PDS 100326 (A4) R1.pdf
Heat-Spring®–Ultra-Low Thermal Resistance No-Reflow as TIM1.5,2,3 PDS 100326 R1.pdf

Related Applications

Heat-Spring® preforms are available for use in a variety of applications.

A thermal image of an electronic circuit board showing areas of varying heat, with bright orange and yellow indicating hot spots and cooler areas in purple and blue.

Burn-in & Test

Burn-in test solutions with soft metal alloys for improved

Close-up of a microchip with a thermal pad layered on top, placed on a circuit board.

Immersion Cooling

A technique on the rise for thermal

Illustration of a microchip with a transparent overlay, revealing internal components and electronic connections, highlighting the precision akin to a tim1 40 design.

TIM1, TIM1.5, TIM2

Metal-based TIMs deliver high thermal performance and

Related Markets

Indium Corporation’s Heat-Spring® preforms are used in a wide-range of markets.

Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!

This image has an empty alt attribute; its file name is scientist-with-microscope.png

Looking for Safety Data Sheets?

Access everything you need — from technical specifications to application guidance — in one convenient location.