Compressible TIMs
Heat-Spring®
Indium Corporation’s patented Heat-Spring® is a soft metal alloy thermal interface material (SMA-TIM) designed as a flexible, patterned foil that serves as an effective thermal conduit between two surfaces. This innovative product is intended for use in a range of high-performance applications, including TIM2, TIM3, TIM1.5, burn-in processes, and immersion cooling systems.
Powered by Indium Corporation
- Ultra-Low Thermal Resistance
- No Reflow or High-Temperature Cure
- Proven Reliability
Product Overview
Product | Recommended Applications | Thickness Range | Special Features |
---|---|---|---|
HSD Heat-Spring® | Small, well-designed interfaces with flat, smooth, and parallel surfaces (2-3 mil non-planar). | Min: 0.004″ (100µm) Max: 0.016″ (400µm) | Optimized for flat, smooth interfaces. |
HSHP Heat-Spring® | Applications with extruded, unfinished heat-sinks or field-fit plates with surface scarring or machine marks. Can also be used in HSD applications. Recommended for immersion cooling (2-5 mil non-planar). | Min: 0.006″ (150µm) Max: 0.016″ (400µm) | High-profile variant of HSD with 2X compressibility. |
HSK Heat-Spring® | Burn-in applications requiring multiple insertions. Features pure indium with an aluminum-clad barrier layer for durability. | Min: 0.006″ (150µm) Max: 0.016″ (400µm) | Aluminum barrier prevents adhesion, staining, and cracking. |
HSx Heat-Spring® | Applications with large CTE mismatches, curved dies, or warping issues. Recommended for immersion cooling (5-10 mil non-planar). | Min:0 .012″ (300µm) Max: 0.040″ (1000µm) | High-profile variant of HSHP with 2X compressibility. Works well with lower pressures. |
Features
Compressible thermal interface material (TIM) operates on the principle that two surfaces joined with metal will effectively conduct heat. A unique pattern is applied to the flat metal shim, creating an array of individual compressible columns that transfer heat independently. Because metal TIM materials possess high thermal conductivity, the interface resistance is only minimally influenced by the thickness of the TIM.
Product Data Sheets
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 (A4) R0.pdf
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 R0.pdf
Heat-Spring®–Ultra-Low Thermal Resistance No-Reflow as TIM1.5,2,3 PDS 100326 (A4) R1.pdf
Heat-Spring®–Ultra-Low Thermal Resistance No-Reflow as TIM1.5,2,3 PDS 100326 R1.pdf
Related Applications
Heat-Spring® preforms are available for use in a variety of applications.
Related Markets
Indium Corporation’s Heat-Spring® preforms are used in a wide-range of markets.
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