Pastas de soldadura para semiconductores
Pastas de Soldadura de Alta Temperatura
Indium Corporation offers a comprehensive range of solder pastes, including semiconductor solder pastes with high-melting temperature alloys for semiconductor die-attach application. Our technical experts are on hand to help you choose the ideal solution. Our industry leading, high-Pb die-attach solder paste has a proven track record, meeting industrial and automotive reliability requirements. Specialized high-Pb, low-alpha emissivity solder alloys are available for automotive grade power MOSFETs. Innovative high-temperature, Pb-free solder Durafuse® HT is an alternative to high-Pb for die-attach. Gold-tin solder paste is the choice for a high-reliability, high thermal conductivity solder die-attach.
Desarrollado por Indium Corporation
- Wide Selections of Pb and Pb-free
- Patented Alloy Technology
- Leading Technical Expertise
Productos
High-temperature solder pastes are typically used for the die-attach of semiconductor dies in discrete components. They are designed to withstand melting temperatures above 260°C, ensuring they do not re-melt during the PCBA reflow process.
Quality Assured
By adhering to stringent standards like AEC-Q101 for automotive reliability, our products and manufacturing processes ensure exceptional quality, joint integrity, and long-term performance.
Wide Selection of Alloys
We offer high-Pb, high-Pb low alpha, and Pb-free options, including gold-tin and our patented Durafuse® HT alloy technology.
Compatible with Various Flux Vehicles
Whether for printing or dispensing, easy-to-clean or ultra-low residue, our range of flux is designed to optimize performance and meet the specific demands of your applications.
No Re-melting at PCBA Peak Reflow Temperatures
Common Pb-based alloys melt between 295°C and 312°C, high-temperature Pb-free alloys around 340°C, and gold-tin paste approximately 280°C. These melting points ensure the solder remains intact during the PCBA reflow process.
Pastas de Soldadura de Alta Temperatura
Commonly selected alloys. Other alloys are available.
| Class | Nombre de la aleación | Composición | Temperatura de fusión | Powder Type* |
|---|---|---|---|---|
| High Pb | Indalloy®151 | Pb5.0Sn2.5Ag | 296°C | T3 & T4 |
| High Pb | Indalloy®163 | Pb2.5Sn2.0Ag | 312°C | T3 & T4 |
| High Pb | Indalloy®171 | Pb5.0Sn | 312°C | T3 & T4 |
| Sin plomo | Durafuse® HT | SnSbAgCu patented dual-alloy | ~350°C | T4 |
| Sin plomo | Indalloy®183 | 80Au20Sn | 280°C | T3 & T4 |
*Most commonly used. Other powder types are available.
Fichas técnicas de productos
WMA-SMQ69HT Pasta de soldar hidrosoluble de alta temperatura PDS 97665 R8.pdf
Pasta de soldar hidrosoluble de alta temperatura Indium6.91 PDS 99376 R1.pdf
Aplicaciones relacionadas
High-temperature solder pastes are suitable for a variety of applications.
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Soldadura a alta temperatura
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Mercados relacionados
Solder paste with a high melting temperature is utilized across various markets.
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