Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT), November 8-10, TianShui City, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the demanding performance improvement of mobile communications that enable the dynamic 5G lifestyle.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes eliminate the cost of cleaning flux residues, improving package reliability by preventing damage to the die from stresses during cleanings. The simplified assembly process can also help reduce total packaging costs.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes provide enhanced activity control that avoids the two main soldering issues: solder bridging and cold joints. This flux technology also retains bump height after reflow, reduces the UBM/bump crack damage in the cleaning process, and boasts a high compatibility with capillary and molded underfills (CUF and MUF).
The suite of fluxes, from the lowest flux residue NC-699 (less than 2%) to NC-26-A (around 5%) and NC-26S (less than 10%), are suitable to be used on a wide range of flip-chip die-attach applications, from typical C4 solder bump to micro Cu pillar bump, from flip-chip on leadframe to flip-chip on wafer/substrate applications.
For more information on Indium Corporation’s ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/fluxes or visit Indium Corporation’s booth.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
