Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT), November 8-10, TianShui City, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the demanding performance improvement of mobile communications that enable the dynamic 5G lifestyle.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes eliminate the cost of cleaning flux residues, improving package reliability by preventing damage to the die from stresses during cleanings. The simplified assembly process can also help reduce total packaging costs.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes provide enhanced activity control that avoids the two main soldering issues: solder bridging and cold joints. This flux technology also retains bump height after reflow, reduces the UBM/bump crack damage in the cleaning process, and boasts a high compatibility with capillary and molded underfills (CUF and MUF).
The suite of fluxes, from the lowest flux residue NC-699 (less than 2%) to NC-26-A (around 5%) and NC-26S (less than 10%), are suitable to be used on a wide range of flip-chip die-attach applications, from typical C4 solder bump to micro Cu pillar bump, from flip-chip on leadframe to flip-chip on wafer/substrate applications.
For more information on Indium Corporation’s ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/fluxes or visit Indium Corporation’s booth.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
