Indium Corporation has invented a new low-temperature solder paste called Durafuse™ LT. This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse™ LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse™ LT’s performance is comparable to SAC305.
Learn More| Indalloy® # | Liquidus (°C) |
Solidus (°C) |
Element 1 |
% | Element 2 |
% | Element 3 |
% | Element 4 |
% |
|---|---|---|---|---|---|---|---|---|---|---|
| 1E | 118 | 118 | In | 52.0 | Sn | 48.0 | ||||
| 1 | 125 | 118 | In | 50.0 | Sn | 50.0 | ||||
| 71 | 131 | 118 | Sn | 52.0 | In | 48.0 | ||||
| 281 | 138 | 138 | Bi | 58.0 | Sn | 42.0 | ||||
| 282 | 140 | 139 | Bi | 57.0 | Sn | 42.0 | Ag | 1.0 | ||
| 290 | 143 | 143 | In | 97.0 | Ag | 3.0 | ||||
| 87 | 145 | 118 | Sn | 58.0 | In | 42.0 | ||||
| 203 | 150 | 125 | In | 95.0 | Bi | 5.0 | ||||
| 88 | 150 | 150 | In | 99.3 | Ga | 0.7 | ||||
| 225 | 151 | 143 | In | 90.0 | Sn | 10.0 | ||||
| 90 | 152 | 152 | In | 99.4 | Ga | 0.6 | ||||
| 91 | 153 | 153 | In | 99.6 | Ga | 0.4 | ||||
| 2 | 154 | 149 | In | 80.0 | Pb | 15.0 | Ag | 5.0 | ||
| 92 | 154 | 154 | In | 99.5 | Ga | 0.5 | ||||
| 4 | 157 | 157 | In | 100.0 | ||||||
| 204 | 175 | 165 | In | 70.0 | Pb | 30.0 | ||||
| 205 | 181 | 173 | In | 60.0 | Pb | 40.0 | ||||
| 231 | 186 | 174 | Sn | 86.5 | Zn | 5.5 | In | 4.5 | Bi | 3.5 |
| 227 | 187 | 175 | Sn | 77.2 | In | 20.0 | Ag | 2.8 | ||
| 226 | 187 | 181 | Sn | 83.6 | In | 8.8 | Zn | 7.6 |
In addition to soldering, Indium Corporation provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.
Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.
Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.
Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.
Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.
| Indalloy® | ||||||
|---|---|---|---|---|---|---|
| Property | 117 | 158 | 160-190 | 217-440 | 255 | 281 |
| Property | Indalloy® 117 | Indalloy® 158 | Indalloy® 160-190 | Indalloy® 217-440 | Indalloy® 255 | Indalloy® 281 |
| Melting Point or Range Deg/F | 117 | 158 | 160-190 | 217-440 | 255 | 281 |
| Weight lbs/in3 | .32 | .339 | .341 | .343 | .380 | .315 |
| Tensile Strength lbs/in2 | 5,400 | 5,990 | 5,400 | 13,000 | 6,400 | 8,000 |
| Brinell Hardness No. | 12 | 9.2 | 9 | 19 | 10.2 | 22 |
| Maximum Load 30 sec lbs/in2 |
--- | 10,000 | 9,000 | 16,000 | 8,000 | 15,000 |
| Safe Load Sustained | --- | 300 | 300 | 300 | 300 | 500 |
| Conductivity (Electrical) Compared with Pure Copper |
3.34% | 4.17% | 4.27% | 2.57% | 1.75% | 5.00% |
