Products
Tacking Agents
Indium Corporation’s portfolio of no-clean, residue-free tacking agent materials simplifies the assembly process with products specifically designed for semiconductor and power module manufacturing. Discover a range of adhesive solutions tailored to your specific chips, die, and solder preform needs.
Powered by Indium Corporation
- Minimize Fixture Requirements
- Achieve Broad Process Tolerance
- Eliminate the Need for Cleaning
Tacking Agent Overview
Robust tack strength
Compatibility with standard assembly materials ensures secure placement of solder preforms, semiconductor dies, and complete packages — without requiring fixtures.
Long working time
Retain tack strength after application at normal temperatures, making materials suitable for soldering and sintering applications where high temperatures are applied during manufacturing.
No residue
There is no trace of residue on the assembly after heating, eliminating the need for post-process cleaning and enabling use in flux-free applications such as formic acid soldering.
Drop-in
Various packaging options such as syringe, cartridge, and bottle packaging are at your disposal, allowing for seamless application or dispensing during the manufacturing process.
Quick Facts
Our products reduce the need for custom fixture in semiconductor and power module manufacturing. By simplifying upfront design work, you can accelerate your cycle times and cut overall costs.
Tacking Agent Products
We offer tacking agents for varying applications, including flip-chip and power electronics.
NC-702A for Flip-Chip
Tacking agents supporting no-clean, fluxless reflow for advanced
InTACK®
Power electronics assembly, tacking agent, no-clean, no-residue, formic acid reflow, solder preforms, dies,
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Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
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