Applications
Low-Temperature Soldering
Low-temperature soldering has surged in popularity, driven by increasing technical and manufacturing challenges and a strong emphasis on sustainability. The industry is increasingly focused on developing alloys and processes tailored to diverse low-temperature needs. At Indium Corporation, we’re transforming the electronics manufacturing landscape with our innovative suite of low-temperature soldering materials and decades of expertise in low-temperate applications.
Overview
Enhancing Performance with Sustainable Solutions
Low-temperature soldering offers both technical and environmental benefits. It helps reduce thermal stress, advance technology for complex designs, and eliminate heat-induced defects like warpages or damage to sensitive components. At the same time, it lowers energy costs and reduces carbon emissions, aligning with environmental regulations and supporting our customers’ sustainability goals.
Low-Temperature Soldering Applications
Attachment to circuit boards
Attachment of temperature-sensitive components to printed circuit boards
Step soldering
Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
Eliminate warpage
Eliminating warpage of thinner chips due to high-temperature reflow
IoT devices
Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
Large area array devices
Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
Low-Temperature Soldering Products
Discover our diverse portfolio of solders, including traditional indium- and bismuth-based alloys, as well as the innovative Bi+ and Durafuse® LT series, designed to meet advanced requirements.
Low-Temperature Solder Pastes
Extensive range of low-temperature solder
High-Reliability Pastes
Wide range of high-reliability solder pastes for various
Fusible Alloys/Low Melting Point Alloys
Utilize low melting points for easy
Indalloy®301LT
Indalloy® 301LT offers versatile solder forms & enhances reliability with lower processing temperatures using InFORMS®
Bismuth Wire
Use it for heat-sensitive components and environmental
Related Applications
Sealing: Cryogenic & Hermetic
Low temperature liquid & fusible alloys for precise melt
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Related Markets
Our low-temperature soldering solutions are used in a wide range of industries, including mobile, server, automotive, infrastructure, and more. We work closely with our customers to provide tailored solutions for their unique applications.
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