Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif.
Dr. Lee’s tutorial, Achieving High Reliability Lead-Free Soldering – Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m. The tutorial discusses material considerations required for achieving high-reliability lead-free solder joints with an emphasis on how various factors contribute to failure modes. He will also talk about how to select the proper solder alloys and surface finishes to achieve high-reliability.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
IWLPC brings together some of the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMs device packaging. For more event information, visit www.iwlpc.com.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
