Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif.
Dr. Lee’s tutorial, Achieving High Reliability Lead-Free Soldering – Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m. The tutorial discusses material considerations required for achieving high-reliability lead-free solder joints with an emphasis on how various factors contribute to failure modes. He will also talk about how to select the proper solder alloys and surface finishes to achieve high-reliability.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣包括用於電子和光電應用的互連和封裝的先進材料，強調高性能和低擁有成本。
IWLPC brings together some of the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMs device packaging. For more event information, visit www.iwlpc.com.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
