Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif.
Dr. Lee’s tutorial, Achieving High Reliability Lead-Free Soldering – Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m. The tutorial discusses material considerations required for achieving high-reliability lead-free solder joints with an emphasis on how various factors contribute to failure modes. He will also talk about how to select the proper solder alloys and surface finishes to achieve high-reliability.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
IWLPC brings together some of the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMs device packaging. For more event information, visit www.iwlpc.com.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
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