Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland.
Lorenz will join nine other industry experts to share insights on forward-looking manufacturing trends within the electronics assembly sector. His presentation will showcase an innovative alloy system designed for high-reliability applications.
The presentations focus, Durafuse HR, is a new high-reliability alloy used for solder paste, developed from the companys Durafuse mixed-alloy technology. It delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications. Engineered to withstand 3,000+ thermal cycles at -40C/125C across different PCB finishes and component types, Durafuse HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys.
No longer does high-reliability have to mean high voiding, as Durafuse HR outperforms SAC305 when it comes to bottom-terminated component voiding while also reducing solder joint cracking and increasing shear strength, said Lorenz.
As a Junior Application Engineer, Lorenz supports Indium Corporations customers across Germany, Austria, and Switzerland, offering engineering guidance and technical specifications. He also accelerates the sales process by providing expert technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelors degree in electrical technology and management.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), à l'adresse www.linkedin.com/company/indium-corporation/.

