Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland.
Lorenz 将与其他九位行业专家一起，分享对电子组装领域前瞻性制造趋势的见解。他的演讲将展示一种专为高可靠性应用而设计的创新合金系统。
Durafuse HR 是一种用于焊膏的新型高可靠性合金，由公司的 Durafuse 混合合金技术开发而成。它具有更强的热循环性能和优异的无效性能，无需真空回流，尤其适用于高可靠性汽车应用。Durafuse HR 可在 -40C/125C 温度条件下承受 3000 多次热循环，适用于不同的印刷电路板表面处理和元件类型，非常适合需要扩展任务曲线的应用，超越了传统无铅合金的性能。
Lorenz 说，高可靠性不再意味着高空洞率，因为 Durafuse HR 在底端元件空洞率方面优于 SAC305，同时还能减少焊点开裂并提高剪切强度。
As a Junior Application Engineer, Lorenz supports Indium Corporations customers across Germany, Austria, and Switzerland, offering engineering guidance and technical specifications. He also accelerates the sales process by providing expert technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelors degree in electrical technology and management.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
