Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
For decades, reflowed indium metal has been the standard for solder TIMs (sTIMs) in most high-performance computing (HPC) TIM1 applications. In his presentation, Optimizing Reflowed Solder TIM (sTIM) Processes for Emerging Heterogeneous Integrated Packages, Dr. Mackie will examine the use of indium metal and its alloys as reflowed sTIMs in both CPU and GPU die-to-lid/die-to-heat spreader TIM1 applications. His presentation includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultra-low voiding. He will also discuss the use of sTIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, semiconductor fabrication, and assembly materials and processes.
His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie was also responsible for the development of Indium Corporations first Applied Technology Roadmap. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet emerging TIM requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. He holds a Ph.D. in physical chemistry from the University of Nottingham, U.K., and a masters of science degree in colloid and interface science from the University of Bristol, U.K.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), sur www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
À propos de la conférence sur les composants électroniques et la technologie
L'ECTC est le premier événement international qui rassemble le meilleur de la science, de la technologie et de l'éducation en matière d'emballage, de composants et de systèmes microélectroniques dans un environnement de coopération et d'échange technique. L'ECTC est parrainé par l'IEEE Electronics Packaging Society (anciennement CPMT). Pour en savoir plus, consultez le site ectc.net.
