Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
For decades, reflowed indium metal has been the standard for solder TIMs (sTIMs) in most high-performance computing (HPC) TIM1 applications. In his presentation, Optimizing Reflowed Solder TIM (sTIM) Processes for Emerging Heterogeneous Integrated Packages, Dr. Mackie will examine the use of indium metal and its alloys as reflowed sTIMs in both CPU and GPU die-to-lid/die-to-heat spreader TIM1 applications. His presentation includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultra-low voiding. He will also discuss the use of sTIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, semiconductor fabrication, and assembly materials and processes.
His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie was also responsible for the development of Indium Corporations first Applied Technology Roadmap. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet emerging TIM requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. He holds a Ph.D. in physical chemistry from the University of Nottingham, U.K., and a masters of science degree in colloid and interface science from the University of Bristol, U.K.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
關於電子元件與技術研討會
ECTC 是首屈一指的國際盛會，匯集了封裝、元件和微電子系統科學、技術和教育方面的佼佼者，提供合作和技術交流的環境。ECTC 由 IEEE 電子封裝協會 (前身為 CPMT) 贊助。如需瞭解更多資訊，請造訪ectc.net。
