Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA.
Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects.
He will also present A Novel Medium-Low Temperature Solder Paste, detailing the development of a new lead-free solder paste with a reflow peak temperature of 200°C. The finished solder joint melted between 180–200°C, allowing for a hierarchy assembly process with alloys that have melting temperatures around 140°C, 190°C, and 220°C.
Dr. Geng focuses on the development of novel lead-free high-reliability solder alloys for automotive applications. He also investigates the assembly process technologies in electronic packaging and interconnections. Dr. Geng earned his Ph.D. in Metallurgy from University of Surrey in the U.K. He continued as a materials scientist after graduation and has extensive experience on materials selection, design, processing, and characterization, especially on processing-structure-property relationships in various materials, including ultra-high temperature alloys, lightweight alloys (Al and Mg), magnetic materials, and ceramics. Dr. Geng is skilled in combinatorial and high-throughput material design using 3D printing and computer programming with Python. He has published more than 20 journal articles in the field of materials science and engineering. He also serves as a peer reviewer for numerous journals.
To view papers authored by Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
