Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA.
Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects.
He will also present A Novel Medium-Low Temperature Solder Paste, detailing the development of a new lead-free solder paste with a reflow peak temperature of 200°C. The finished solder joint melted between 180–200°C, allowing for a hierarchy assembly process with alloys that have melting temperatures around 140°C, 190°C, and 220°C.
Dr. Geng focuses on the development of novel lead-free high-reliability solder alloys for automotive applications. He also investigates the assembly process technologies in electronic packaging and interconnections. Dr. Geng earned his Ph.D. in Metallurgy from University of Surrey in the U.K. He continued as a materials scientist after graduation and has extensive experience on materials selection, design, processing, and characterization, especially on processing-structure-property relationships in various materials, including ultra-high temperature alloys, lightweight alloys (Al and Mg), magnetic materials, and ceramics. Dr. Geng is skilled in combinatorial and high-throughput material design using 3D printing and computer programming with Python. He has published more than 20 journal articles in the field of materials science and engineering. He also serves as a peer reviewer for numerous journals.
To view papers authored by Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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