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Indium Corporation Expert to Present at IPC Electronics Materials Forum

Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA.

Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects. 

He will also present A Novel Medium-Low Temperature Solder Paste, detailing the development of a new lead-free solder paste with a reflow peak temperature of 200°C. The finished solder joint melted between 180–200°C, allowing for a hierarchy assembly process with alloys that have melting temperatures around 140°C, 190°C, and 220°C.

Dr. Geng focuses on the development of novel lead-free high-reliability solder alloys for automotive applications. He also investigates the assembly process technologies in electronic packaging and interconnections. Dr. Geng earned his Ph.D. in Metallurgy from University of Surrey in the U.K. He continued as a materials scientist after graduation and has extensive experience on materials selection, design, processing, and characterization, especially on processing-structure-property relationships in various materials, including ultra-high temperature alloys, lightweight alloys (Al and Mg), magnetic materials, and ceramics. Dr. Geng is skilled in combinatorial and high-throughput material design using 3D printing and computer programming with Python. He has published more than 20 journal articles in the field of materials science and engineering. He also serves as a peer reviewer for numerous journals.

To view papers authored by Indium Corporation experts, visit www.indium.com/techlibrary.

インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。

インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。