Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan.
Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:
- Increases lateral strength
- Maintains bondline co-planarity
- Improves thermal cycling reliability
For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or stop to see us at the show at booth #E27-10.
Pour plus d'informations sur Indium Corporation, rendez-vous surindiumstg.wpenginepowered.comou envoyez un e-mailà [email protected]. Vous pouvez également suivre nos experts, « From One Engineer ToAnother® »(#FOETA), surwww.facebook.com/indiumou@IndiumCorp.
