Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan.
Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:
- Increases lateral strength
- Maintains bondline co-planarity
- Improves thermal cycling reliability
For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or stop to see us at the show at booth #E27-10.
Weitere Informationen über die Indium Corporation finden Sie unterindiumstg.wpenginepowered.comoder per E-Mailan [email protected]. Sie können unseren Experten von „From One Engineer ToAnother®“(#FOETA) auch unterwww.facebook.com/indiumoder@IndiumCorp folgen.
