Indium Corporation Features InFORMS Reinforced Solder Ribbon for Automated Assembly at NEPCON Japan 2018

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan.

Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:

• Increases lateral strength
• Maintains bondline co-planarity
• Improves thermal cycling reliability

For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or stop to see us at the show at booth #E27-10.

如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer To^Another®」（#FOETA）。