Indium Corporation Director of Business Development and Printed Circuit Board Assembly products Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada.
Eric will present Shaping the Future Solder Industry, which discusses how accelerating end user technological needs have driven developments in the soldering industry. Eric will also explore the increasing tendency for economic and geopolitical forces to shape both regulation and the supply structure of raw materials and end products.
In addition, Indium Corporation’s Global Sales Manager for NanoBond® and NanoFoil®, Jacques Matteau, and Research Metallurgist, Weiping Liu, will share their technical expertise with attendees.
Jacques’ presentation, NanoBond® Assembly – A Rapid, Room Temperature Soldering Process, describes NanoBonding, a new class of nanoengineered materials in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process.
Dr. Liu will present A Composite Solder Alloy Preform for High Temperature Pb-free Soldering Applications. This paper outlines the development of a special laminate composite preform for high-temperature Pb-free soldering applications that require a melting temperature of over 280°C.
Eric has more than 25 year of experience in the electronic assembly materials and component field, and has held a variety of technical, marketing and operations management roles. He earned his bachelor’s degree in chemistry from the University of Illinois at Urbana-Champaign and his master of business administration from the Kellogg Graduate School of Management.
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil products to the target industry, where it is used to NanoBond targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Dr. Liu earned a doctorate in materials science and engineering from the Harbin Institute of Technology, China, and performed post-doctoral work at the Technical University of Berlin, Germany. Dr. Liu has published more than 70 research papers in the area of materials joining and processing, and has received several "best paper" awards at international conferences. He was awarded the American Welding Society’s Masubuchi Award in 2004, served on the International Scientific Advisory Board for the AWS, and ASM organized International Brazing and Soldering Conferences in 2000, 2006, and 2009.
For more information, visit www.asminternational.org.
Indium Corporation est un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures, des préformes et des flux, des brasures, des cibles de pulvérisation, des métaux et des composés d'indium, de gallium et de germanium, ainsi que Reactive NanoFoil®. Fondée en 1934, Indium Corporation dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected].
