Indium Corporation Director of Business Development and Printed Circuit Board Assembly products Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada.
Eric will present Shaping the Future Solder Industry, which discusses how accelerating end user technological needs have driven developments in the soldering industry. Eric will also explore the increasing tendency for economic and geopolitical forces to shape both regulation and the supply structure of raw materials and end products.
In addition, Indium Corporation’s Global Sales Manager for NanoBond® and NanoFoil®, Jacques Matteau, and Research Metallurgist, Weiping Liu, will share their technical expertise with attendees.
Jacques’ presentation, NanoBond® Assembly – A Rapid, Room Temperature Soldering Process, describes NanoBonding, a new class of nanoengineered materials in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process.
Dr. Liu will present A Composite Solder Alloy Preform for High Temperature Pb-free Soldering Applications. This paper outlines the development of a special laminate composite preform for high-temperature Pb-free soldering applications that require a melting temperature of over 280°C.
Eric has more than 25 year of experience in the electronic assembly materials and component field, and has held a variety of technical, marketing and operations management roles. He earned his bachelor’s degree in chemistry from the University of Illinois at Urbana-Champaign and his master of business administration from the Kellogg Graduate School of Management.
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil products to the target industry, where it is used to NanoBond targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Dr. Liu earned a doctorate in materials science and engineering from the Harbin Institute of Technology, China, and performed post-doctoral work at the Technical University of Berlin, Germany. Dr. Liu has published more than 70 research papers in the area of materials joining and processing, and has received several "best paper" awards at international conferences. He was awarded the American Welding Society’s Masubuchi Award in 2004, served on the International Scientific Advisory Board for the AWS, and ASM organized International Brazing and Soldering Conferences in 2000, 2006, and 2009.
For more information, visit www.asminternational.org.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗金屬及化合物；以及 Reactive NanoFoil®。Indium Corporation 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
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