Blog

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

Non tutti i metalli vanno d'accordo tra loro. E questo si ripercuote nel mondo dell'elettronica e dei materiali utilizzati. Un esempio relativamente nuovo e rilevante si è avuto con l'avvento della RoHS e della

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

Folks, Let’s see how Patty is doing with her latest challenge….. Patty had decided to call The Professor and see what advice he had to offer in preparation for her visit to the facility

Gente, vediamo cosa succede a Patty........ Patty sedeva al suo computer, ammettendo di essere un po' stanca. Era appena rientrata dopo una settimana di vacanza a Colonial Williamsburg con

I processi di bumping dei wafer si sono evoluti negli ultimi 10 anni. L'industria dell'assemblaggio dei semiconduttori è passata da processi di bumping che utilizzano la stampa di pasta saldante (con tutti i suoi problemi di voiding),

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally

NanoFoil®requires a threshold of energy to activate. What happens if that energy value is not met?: Interdiffusion and inhibition of the NanoBond® reaction. This can happen if NanoFoil®

Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden

Being the Indium Corporation, we know what indium is, where it comes from, and how to use it. But sometimes we forget that not everyone is as immersed in indium as we are. So what is indium? Of

Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy

Esistono molti materiali per bersagli di sputtering che risultano difficili da saldare. Per quelle leghe “tiriamo fuori l’artiglieria pesante”: in questo caso, la nostra saldatura a ultrasuoni

Per eseguire il NanoBond® su componenti realizzati in rame, nichel o platino, è necessario applicare prima la lega di saldatura sulla superficie di incollaggio. Questa operazione viene solitamente eseguita fondendo la lega di saldatura direttamente sulla

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

Sometimes one piece of NanoFoil® just isn’t enough… We often NanoBond® sputtering targets which are large enough to require multiple sheets of NanoFoil® to cover the width or

Hand cutting is only one option for shaping NanoFoil®, however it is quick, easy, and inexpensive. All you need to cut NanoFoil® with this method is a good cutting surface, metal straight

Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated

A few years back, Indium Corporation's own Eric Bastow set up a prototype NanoFoil® plating process to demonstrate the material and cost savings of setting up a small plating bath. One of the

One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use

Abbiamo sentito parlare del difetto di "graping" della pasta saldante, ma lo stesso problema di ossidazione si verifica anche in altre forme di saldatura, come ad esempio le preforme di rondella di saldatura utilizzate per attaccare piccoli