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Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

并非所有金属都能很好地结合在一起。这一点也影响到了电子产品及其所用材料。一个相对较新的相关例子出现在 RoHS 和

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

Folks, Let’s see how Patty is doing with her latest challenge….. Patty had decided to call The Professor and see what advice he had to offer in preparation for her visit to the facility

朋友们，让我们看看 Patty........ 到底怎么了？帕蒂坐在电脑前，诚然有些疲惫。她刚从威廉斯堡殖民地度假一周回来。

Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding,

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally

NanoFoil®requires a threshold of energy to activate. What happens if that energy value is not met?: Interdiffusion and inhibition of the NanoBond® reaction. This can happen if NanoFoil®

Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden

铟泰公司，我们了解铟是什么、它来自哪里，以及如何使用它。但有时我们会忘记，并非所有人都像我们一样对铟如此熟悉。那么，铟究竟是什么呢？关于

Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy

There are many sputtering target materials that are tricky to solder to. For those alloys we ‘bring out the big guns’ – in this case, our ultrasonic soldering

In order to NanoBond® parts that are made out of copper, nickel, or platinum, we must first apply solder to the bonding surface. This is most commonly done by melting solder directly onto the

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

Sometimes one piece of NanoFoil® just isn’t enough… We often NanoBond® sputtering targets which are large enough to require multiple sheets of NanoFoil® to cover the width or

Hand cutting is only one option for shaping NanoFoil®, however it is quick, easy, and inexpensive. All you need to cut NanoFoil® with this method is a good cutting surface, metal straight

Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated

A few years back, Indium Corporation's own Eric Bastow set up a prototype NanoFoil® plating process to demonstrate the material and cost savings of setting up a small plating bath. One of the

One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use

We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as solder washer preforms used to attach small