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Sample Size Matters in Weibull Analysis Too

Folks, Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering

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What a J-STD-004 classification of “OR” means and what it doesn’t mean

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder

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Donuts and Solder Preforms – Seriously?

I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be

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An Example of Cpk and Non Normal Data In Electronics Assembly Soldering

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her

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铟和铝的电化学腐蚀……这真的值得担忧吗???

My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

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Cpk 只能从正态分布的数据中计算出来

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

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One-Step OSP BGA Soldering Application

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

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Printer Process Set-up

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

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Effect of Package and Die Size on Dipping and Pick-up

While in South East Asia last summer, Indium's technical team and I had a chance to discuss flip-chip dipping processes with a major equipment

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The Importance of Oxygen Barrier in Solder Pastes

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

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Choosing a Leadframe or DBC Finish for Die-Attach in Power Devices

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

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Lack of Concern for Tin Pest as a Reliability Issue in Mission Critical Products Still Hard to Understand

Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability concerns related to tin whiskers, I am surprised that

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RDSON 和焊料体积电阻率

Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that Indium make this available to all through a blog

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Solder 101: Forms of Indium Metal

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

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Bi/Sn/Ag: The Perfect Tabbing Ribbon Coating Solder Alloy?

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

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铟真空密封、密闭 超低温

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

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Calculating Solder Paste Usage

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production

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个人电脑已死?

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

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异种金属的电化学腐蚀

并非所有金属都能很好地结合在一起。这一点也影响到了电子产品及其所用材料。一个相对较新的相关例子出现在 RoHS 和

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Per Homogeneous Material Also Applies to Medical Devices Under RoHS

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

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Indium Sulfide for Thin Film Solar Cells

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。